? semiconductor components industries, llc, 2012 january, 2012 ? rev. 5 1 publication order number: mbrm130l/d mbrm130lt1g, NRVBM130LT1G, mbrm130lt3g, nrvbm130lt3g surface mount schottky power rectifier powermite ? power surface mount package the schottkypowermite ? employs the schottky barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop ? reverse current tradeoff. the advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount rectifier. with its unique heatsink design, thepowermite ? has the same thermal performance as the sma while being 50% smaller in footprint area, and delivering one of the lowest height profiles, ? 1.1 mm in the industry. because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, pdas and pcmcia cards. typical applications are ac ? dc and dc ? dc converters, reverse battery protection, and ?oring? of multiple supply voltages and any other application where performance and size are critical. features ? low profile ? maximum height of 1.1 mm ? small footprint ? footprint area of 8.45 mm 2 ? low v f provides higher efficiency and extends battery life ? supplied in 12 mm tape and reel ? low thermal resistance with direct thermal path of die on exposed cathode heat sink ? esd ratings: ? human body model = 3b (> 16 kv) ? machine model = c (> 400 v) ? aec ? q101 qualified and ppap capable ? nrvb prefix for automotive and other applications requiring unique site and control change requirements ? all packages are pb ? free* mechanical characteristics: ? powermite ? is jedec registered as d0 ? 216aa ? case: molded epoxy ? epoxy meets ul 94 v ? 0 @ 0.125 in ? weight: 16.3 mg (approximately) ? lead and mounting surface temperature for soldering purposes: 260 ? c maximum for 10 seconds *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. schottky barrier rectifier 1.0 amperes, 30 volts http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. device package shipping ? ordering information mbrm130lt1g powermite (pb ? free) 3,000 / tape & reel mbrm130lt3g powermite (pb ? free) 12,000 / tape & reel powermite case 457 plastic cathode anode marking diagram m = date code bcg = device code = pb ? free package NRVBM130LT1G powermite (pb ? free) 3,000 / tape & reel nrvbm130lt3g powermite (pb ? free) 12,000 / tape & reel m bcg 12
mbrm130lt1g, NRVBM130LT1G, mbrm130lt3g, nrvbm130lt3g http://onsemi.com 2 maximum ratings rating symbol value unit peak repetitive reverse voltage working peak reverse voltage dc blocking voltage v rrm v rwm v r 30 v average rectified forward current (at rated v r , t c = 135 ? c) i o 1.0 a peak repetitive forward current (at rated v r , square wave, 100 khz, t c = 135 ? c) i frm 2.0 a non ? repetitive peak surge current (non ? repetitive peak surge current, halfwave, single phase, 60 hz) i fsm 50 a storage temperature t stg ? 55 to 150 ? c operating junction temperature t j ? 55 to 125 ? c voltage rate of change (rated v r , t j = 25 ? c) dv/dt 10,000 v/ s stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. thermal characteristics characteristic symbol value unit thermal resistance, junction ? to ? lead (anode) (note 1) thermal resistance, junction ? to ? tab (cathode) (note 1) thermal resistance, junction ? to ? ambient (note 1) r tjl r tjtab r tja 35 23 277 ? c/w 1. mounted with minimum recommended pad size, pc board fr4, see figures 9 & 10 electrical characteristics characteristic symbol value unit maximum instantaneous forward voltage (note 2), see figure 2 v f t j = 25 ? c t j = 85 ? c v (i f = 0.1 a) (i f = 1.0 a) (i f = 3.0 a) 0.30 0.38 0.52 0.20 0.33 0.50 maximum instantaneous reverse current (note 2), see figure 4 i r t j = 25 ? c t j = 85 ? c ma (v r = 30 v) (v r = 20 v) (v r = 10 v) 0.41 0.13 0.05 11 5.3 3.2 2. pulse test: pulse width ? 250 s, duty cycle ? 2% i f , instantaneous forward current (amps) i f , instantaneous forward current (amps) figure 1. typical forward voltage figure 2. maximum forward voltage 0 v f , instantaneous forward voltage (volts) 10 1.0 v f , maximum instantaneous forward voltage (volts) 0.1 0.3 0.1 0.2 0.4 t j = 85 ? c t j = 150 ? c t j = ? 40 ? c t j = 25 ? c 10 1.0 0.1 0.6 t j = 125 ? c 0.5 0 0.3 0.1 0.2 0.4 t j = 85 ? c t j = 150 ? c t j = ? 40 ? c t j = 25 ? c 0.6 t j = 125 ? c 0.5
mbrm130lt1g, NRVBM130LT1G, mbrm130lt3g, nrvbm130lt3g http://onsemi.com 3 i r , maximum reverse current (amps) i r , reverse current (amps) figure 3. typical reverse current figure 4. maximum reverse current 20 0 v r , reverse voltage (volts) 10e ? 3 1.0e ? 3 100e ? 6 10e ? 6 1.0e ? 6 v r , reverse voltage (volts) 5.0 10 15 30 0 100e ? 6 10e ? 6 5.0 10 15 t j = 85 ? c t j = 25 ? c 100e ? 3 10e ? 3 1.0e ? 3 30 25 20 25 t j = 85 ? c t j = 25 ? c p fo , average power dissipation (watts) i o , average forward current (amps) i pk /i o = 5 figure 5. current derating figure 6. forward power dissipation 45 75 25 t l , lead temperature ( ? c) 1.8 1.2 1.0 0.8 0.2 0 i o , average forward current (amps) 0.2 0 0.7 0.6 0.5 0.3 0.1 0 1.0 55 115 105 1.4 0.4 0.8 1.2 1.6 0.4 125 1.6 square wave dc i pk /i o = i pk /i o = 10 i pk /i o = 20 i pk /i o = 20 i pk /i o = 10 i pk /i o = 5 i pk /i o = square wave dc 0.6 0.4 freq = 20 khz 0.6 1.4 0.2 35 65 85 95 t j , derated operating temperature ( c) c, capacitance (pf) figure 7. capacitance figure 8. typical operating temperature derating * 0 v r , reverse voltage (volts) 1000 100 10 v r , dc reverse voltage (volts) 15 30 0 60 40 20 10 5.0 15 20 5.0 10 50 140 150 * reverse power dissipation and the possibility of thermal runaway must be considered when operating this device under any re- verse voltage conditions. calculations of t j therefore must include forward and reverse power effects. the allowable operating t j may be calculated from the equation: t j = t jmax ? r(t)(pf + pr) where r(t) = thermal impedance under given conditions, pf = forward power dissipation, and pr = reverse power dissipation this graph displays the derated allowable t j due to reverse bias under dc conditions only and is calculated as t j = t jmax ? r(t)pr, where r(t) = rthja. for other power applications further calculations must be performed. r tja = 10 ? c/w 15 ? c/w 25 ? c/w 35 ? c/w t j = 25 ? c 30 20 25 80 25 20 ? c/w 30 120 100 110 130 90 70
mbrm130lt1g, NRVBM130LT1G, mbrm130lt3g, nrvbm130lt3g http://onsemi.com 4 r (t) , transient thermal resistance (normalized) r (t) , transient thermal resistance (normalized) t, time (s) 1.0 0.1 0.01 0.001 100 0.1 0.00001 1,000 0.0001 0.001 0.01 1.0 10 rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0% figure 9. thermal response junction to lead 100 0.1 0.00001 t, time (s) 1.0 0.1 0.01 0.0001 0.001 0.01 1.0 10 0.001 rtjl(t) = rtjl*r(t) 50% 20% 10% 5.0% 2.0% 1.0% figure 10. thermal response junction to ambient
mbrm130lt1g, NRVBM130LT1G, mbrm130lt3g, nrvbm130lt3g http://onsemi.com 5 package dimensions powermite case 457 ? 04 issue e dim min max min max inches millimeters a 1.75 2.05 0.069 0.081 b 1.75 2.18 0.069 0.086 c 0.85 1.15 0.033 0.045 d 0.40 0.69 0.016 0.027 f 0.70 1.00 0.028 0.039 h -0.05 +0.10 -0.002 +0.004 j 0.10 0.25 0.004 0.010 k 3.60 3.90 0.142 0.154 l 0.50 0.80 0.020 0.031 r 1.20 1.50 0.047 0.059 s notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. 3. dimension a does not include mold flash, protrusions or gate burrs. mold flash, protrusions or gate burrs shall not exceed 0.15 (0.006) per side. s b m 0.08 (0.003) c s t ? a ? ? b ? s j k ? t ? h l j c d s b m 0.08 (0.003) c s t f pin 1 pin 2 r 0.50 ref 0.019 ref 2.54 0.100 0.635 0.025 1.27 0.050 2.67 0.105 0.762 0.030 mm inches scale 10:1 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 1: pin 1. cathode 2. anode on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 mbrm130l/d powermite is a registered trademark of and used under a license from microsemi corporation. literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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